离子处理Ag薄膜的表面结构和润湿性的机理研究,The Journal of Physical Chemistry C

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离子处理Ag薄膜的表面结构和润湿性的机理研究
The Journal of Physical Chemistry C ( IF 3.3 ) Pub Date : 2016-03-04 00:00:00 , DOI: 10.1021/acs.jpcc.5b11944
Udai B. Singh ₁ , R. P. Yadav , Ratnesh K. Pandey ₂ , D. C. Agarwal _{1,

3} , Compesh Pannu ₁ , A. K. Mittal

Affiliation

使用热尖峰和分形分析研究了涉及100 MeV Ag离子处理的Ag薄膜的表面形态和润湿性演变的洞察机制。在原子力显微镜（AFM），扫描电子显微镜（SEM）和接触角（CA）测量的基础上，将纳米结构和润湿性的结果关联起来。SEM图像显示了离子诱导的Ag纳米结构的演化和Ag表面覆盖面积的减少。原子力显微镜图像揭示了纳米结构的形成。自相关和功率谱密度（PSD）函数用于表征表面轮廓，这些可以确认纳米结构的形成。分形分析是在原始的和离子束定制的表面上进行的，以探索涉及纳米结构的机理。观察到界面宽度，横向相关长度和粗糙度指数取决于离子剂量。表面润湿性的变化与界面宽度和成分变化密切相关。为了了解离子处理后表面形态的发展，已经进行了热尖峰模拟。纳米结构的形成和表面覆盖面积的减少是溅射，去湿和扩散过程机理之间竞争的结果。

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Insight Mechanisms of Surface Structuring and Wettability of Ion-Treated Ag Thin Films

Insight mechanisms involved in the evolution of surface morphology and wettability of 100 MeV Ag-ion-treated Ag thin films have been studied using thermal spike and fractal analysis. The results of nanostructuring and wettability are correlated on the basis of atomic force microscopy (AFM), scanning electron microscopy (SEM), and contact angle (CA) measurements. The SEM images show ion-induced evolution of Ag nanostructures and reduction in the surface coverage area of Ag. The AFM images reveal the formation of nanostructures. The autocorrelation and power spectral density (PSD) functions are used to characterize the surface profile, and these confirm the formation of nanostructures. Fractal analysis is performed on pristine and ion beam tailored surfaces to explore the mechanism involved in nanostructuring. It is observed that interface width, lateral correlation length, and roughness exponent depend on ion doses. The variation in the wettability of surfaces is well correlated with interface width and compositional variation. Thermal spike simulations have been performed to understand the development of the surface morphology after ion treatment. The formation of nanostructures and reduction in surface coverage area are consequences of competition among the mechanisms of sputtering, dewetting, and diffusion processes.

更新日期：2016-03-04

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